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Laser-Based Micro- and Nano-Packaging and Assembly Conference
Laser-Based Micro- and Nano-Packaging and Assembly Conference will be held in San Jose, CA, USA on 24th - 29th January 2009.
The aim of this conference is to bring together scientists and engineers working on application-oriented aspects of laser-based micro- and nano-packaging for mechanical, electronic, photonic, chemical, biological, bio-active or bio-compatible devices. Papers are solicited on the following application-oriented
topics and other packaging related issues.
Abstract Due Date is 14 July 2008
More information, please visit at:Laser-Based Micro- and Nano-Packaging and Assembly Conference
The ceramics substrates microprocessing by high precision laser technologies for microsystems, microsensors and actuators applications
Dr. Dumitru Ulieru (a), Dr. Ileana Cernica (b)
(a) ROMES S.A., 126 A, Iancu Nicolae Str, 77190, Voluntari (Bucharest), Romania,
(b) IMT – Bucharest, 32B, Erou Iancu Nicolae Str., 77190, Voluntari (Bucharest), Romania
Microsystems (MST) as MEMS, MOEMS, MCMs, microsensors and actuators uses the same techniques as microelectronics processing to create structural components that are essentially micronic or submicronic mechanical parts. These parts usually require high precision fabrication unless post-fabrication finishing. For various types of materials of which a great used for obtaining microsystems, micro and nanodevices the laser micro and nanoprocessing is the best solution for accuracy and roughness surface quality high precision technologies suitable for batch processing of ceramics and other MSN substrate materials.
- High precision microdrilling of microvias and different microholes configurations.
Technical features of microprocessing for microsystems application with RF MCM detailed presented in the paper as
shown on more tables with analyze of answers of more kind of support materials at laser radiation. The authors present also the detailed results of microprocessing of microholes realized by different lasers radiation as UV, Nd:YAG and CO2 for microvias of higher layers count for high density circuits ( HDI ) connection microholes as blind, through tapered holes, circular a/o squared areas etc. - Microcutting and contouring processing by high precision laser technologies.
On the paper are presented the experiments and results studies obtained by the authors on the basis of high precision laser for chips separation and / or singulation on ceramics wafer processed including as individual extraction possibility. - Surface patterning generation by laser microprocessing
The fine pattern generation of metal or alloy films on ceramic substrates can be structured directly with the laser direct patterning process. Our novel technology applications unless chemicals can resolve this problem by offering structuring processing of sensors and sensors systems able to fulfill these requirements.
Simulating electroplated micro surfaces in 3-D
A H. J. Jeon (1), J Low (1), A. R. Mileham (1), A.N. Bramley (1), C. Johal (2)
1 Department of Mechanical Engineering, University of Bath, BA27AY, UK
2 Glacier Vandervell Bearings Ltd, Rugby, UK
This paper describes the development, comparison and validation of a 3-D model of the electroplating process. It is based on the current density distribution that is generated using the Finite Element Method (FEM) and is used together with Faraday's law of electrolysis and various material and electrolyte values to determine the local plating depth. It has been developed initially to model the depth of the micro layer deposited on the work surface of an automotive engine’s "big end" shell bearing. Actual plating trials were conducted in a series of controlled laboratory experiments using an industrial type jig and industrial plating conditions. These consisted of a steel cathode (the bearing) and a lead anode. The results described here, in this paper, show good agreement between the 3-D simulation and the actual plating depth and profile and are considered to validate the model sufficiently for it to be used for electroplating tooling design and micro-electroforming.
Development of an industrial device of blend/filling of heterogenous powders
L. Federzoni (a), M.L. Penaud (a), S. Revol (a), O. Dauchot (b), F. Daviaud (b)
a CEA-Grenoble, DTEN/STN/LT2N, F38054 Grenoble cedex 9
b CEA-Saclay, DSM/DRECAM/SPEC, l’Orme des merisiers, 91191 GIF on Yvette
In many industrial fields -- as varied as pharmacy, food, powder metallurgy, ..., the handling of powders or blends of powders is a stage impossible to circumvent during which many difficulties can occur. In particular when it is a question of filling a die by materials finely divided prior to a compression stage, it is very difficult to ensure the transport and the deposition of powder in a controlled, homogeneous and fast way. The situation is even more delicate when one wants to use a blend of powders : at each stage of the process, and in particular during the discharge in the die, segregation may occur. The finer the powders, the more difficult it will be to avoid difficulties. In powder metallurgy, many components are manufactured by the compaction of metal powders obtained by chemical synthesis or atomization means. The powders are deposited in a cavity or die presenting the form which one wants to give to the component. The powder is then compacted under high pressure, and the green parts thus obtained are then sintered.
We have developed a device which ensures the homogeneity of the density distribution of the powder in the die. In addition, our device allows to preserve the composition homogeneity in the case of an initially prepared blend of powders. When two separate batches of powders are used, we show that the blending operation can be carried out simultaneously with the filling.
High aspect ratio micron-sized vias in "flex" and polymer foils using ion irradiation
H. Yousef, M. Lindeberg, K. Hjort
Department of Engineering Sciences, Uppsala University, Box 534, 75121 Uppsala, Sweden
As the call for higher wiring density in packaging and interconnection technologies rapidly evolves, the need for smaller dimensions in vias and interconnects must be met. The frontier of advanced high aspect ratio technologies is today often found within microelectronics and MEMS. The process described in this paper stems from advanced MEMS and allows micromachining of deep, vertical vias in polyimide based foils and flexible-PCBs. The process is superior with respect via throughput and size compared with traditional via manufacturing techniques such as chemical etching, drilling, dry etching and laser ablation.
The technique makes use of ion irradiation to enhance the selectivity and directionality of the chemical etching technique. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Conventional electrodeposition from a metallic seed layer is used to fill these structures with metal. The smallest achievable size of the vias is only limited by the resolution of the mask; vias of below 10 μm in diameter can readily be achieved in a 75 μm thick polyimide foil. It is possible to obtain two inherently different types of via structures using this process: (1) conventional solid vias, and (2) vias consisting of bundles of sub-micron wires (having a specified metal density between 0.2 and 20%). As the individual sub-micron wires have aspect ratios of several hundreds, this allows fabrication of truly vertical via structures, allowing ultra high-density wiring.
Fabrication Chain for Prototyping of Microfluidic Chips in Polymers
T. Brenner, C. Müller, H. Reinecke, R. Zengerle, and J. Ducrée
IMTEK – University of Freiburg, Georges-Koehler-Allee 106, D-79110 Freiburg, Germany
We established an integrated prototyping chain for rapid fabrication of microfluidic chips in polymers comprising fabrication of masters made from elastomers, replication into polymers by soft embossing, surface modification and thermal sealing. Our techniques enable rapid and precise fabrication of fully functionalized microfluidic chips featuring typical minimum lateral dimensions of 50 μm and aspect ratios smaller than one.
Study of Factors Affecting Aspect Ratios Achievable in Micro-injection Moulding
B. Sha, S.S. Dimov, D.T. Pham and C. A. Griffiths
Manufacturing Engineering Centre, Cardiff University, Cardiff CF24 3AA, UK
Micro-injection moulding is one of the key technologies for micro-manufacture because of its mass-production capability and relatively low component cost. The replication of micro-features is an important issue in broadening the use of this technology. The aspect ratios achievable in replicating such features are one of the most important process characteristics and constitute a major manufacturing constraint in applying injection moulding in a range of micro-engineering applications. This research studies the effects of five process factors and one size factor on the achievable aspect ratios, and the role they play in producing micro components in different polymer materials. In particular, the following factors are considered: barrel temperature, mould temperature, injection speed, holding pressure, the existence of air evacuation, and the size of micro features. The study revealed that the barrel temperature and the injection speed are the key factors affecting the aspect ratios of micro features replicated in PP and ABS. In the case of POM, in addition to these two factors, the mould temperature is also an important factor for improving the replication capabilities of the micro-injection moulding process. For all three materials, an increase of feature sizes improves the melt flow. However, the melt fill of micro features does not increase linearly with the increase of their sizes.
Manufacturing of high quality micro prototypes by injection molding using hybrid mold technology
A. Frick (a), C. Stern (a), U. Berger (b)
a Polymer Sciences and Processing, Aalen University of Applied Sciences AAUAS, Aalen 73430, Germany
b Department of Mechatronics, Aalen University of Applied Sciences AAUAS, Aalen 73430, Germany
A larger number of polymeric prototypes with special material properties are often demanded for research and development. Thereby, it is most essential that the prototypes are made from the target material and the related processing technique. A sophisticated and fast possibility to obtain a mold for replicating parts (prototypes) by injection molding is making inserts for hybrid molds, using a rapid prototyping (RP) technique. RP technique (e.g. stereolithography) allows shaping complex mold cavity geometries as well as curved cooling conducts, what is not possible by conventional manufacturing.
The manufacturing of high quality micro parts by injection molding requires a plasticizing unit with small screw channel volume to reduce the residence time of the polymeric melt. Nowadays, the minimal commercially available screw diameter is 14 mm. A newly developed plasticizing unit with a screw diameter of 12mm, which was done at AAUAS in collaboration with ARBURG, permits a gentle processing of polymers, spending only half of the residence time. This is an advantage when micro prototypes are manufactured in a single-cavity mold.
The present work points out, how the combination of the benefits of stereolithography and micro injection molding can be successfully used for producing micro prototypes. By means of some examples, it is shown that the performance of small plastic products (part mass in the milligram range) can be optimized by choosing the right material and processing technique. Thus the spectrum of application of micro parts can be extended.
A new approach in polymer waveguide fabrication
Severin Dahms, Frederik Bundgaard and Oliver Geschke
MIC - Department of Micro and Nanotechnology, Technical University of Denmark (DTU), Building 345 East, 2800 Kgs. Lyngby, Denmark
Waveguides are an excellent means of integrating sensor components in single use microfluidic polymer systems. However, most processes for producing on-chip waveguides require several process steps, some of which are not suited for mass production. We report a simple procedure in which two different grades of the cyclic olefin copolymer (COC) Topas® are used as substrate and core layer. In a spin coating process a Topas® grade with high refractive index is spin coated onto the injection moulded substrate with lower refractive index, thereby generating a core layer. A simple hot embossing process enables simultaneous structuring of waveguides and microfluidic channels in the core layer. In a final step the microfluidic structures can be closed with a lid, either by thermal bonding or by laser transmission welding.
The refractive index and glass transition temperature Tg can be altered by changing the ratio between the two copolymers of Topas®. The low optical transmission loss of the material, along with its chemical resistance and low water absorption, makes Topas® a good choice for making integrated optics in microfluidic systems.
Polymer technology for disposable microfluidics
R. Jurischka (a), Ch. Blattert (a), I. Tahhan (a), A. Schoth (a), H. Reinecke (a),
a Laboratory for Process Technology, Institute of Microsystem Technology, University of Freiburg, 79110 Freiburg, Germany
Present main applications of microfluidic devices are within the life sciences or chemical analysis. Polymers are ideally suited for these applications due to their material properties and their applicability for high volume production. In this study, we developed a rapid manufacturing technology for disposable microfluidic devices using UV-LIGA and injection molding. Exchangeable inserts for the molding tool were fabricated by a modified UV-LIGA technology. The UV-LIGA process is based on a SU-8 lithography with a metal substrate, which allows for a reduction of the nickel electroplating time. These inserts enable a cost effective structuring of polymers. Different prototypes of chips for microfluidic applications with channel dimensions down to 10 μm and aspect ratios of 8 have been fabricated. The electroplated nickel structure has a hardness of 800 Vickers and an excellent top surface roughness of Ra
Surface Microstructure Replication in Injection Moulding
H. N. Hansen, U. A. Theilade
Department of Manufacturing Engineering and Management, Technical University of Denmark, Building 427, Produktionstorvet, DK-2800 Kgs. Lyngby, Denmark
In recent years polymer components with surface microstructures have been in rising demand for applications such as lab-on-a-chip and optical components. Injection moulding has proven to be a feasible and efficient way to manufacture such components. In injection moulding the mould surface topography is transcribed onto the plastic part through complex mechanisms. This replication however, is not perfect, and the replication quality depends on the plastic material properties, the topography itself, and the process conditions. This paper describes and discusses an investigation of injection moulding of surface microstructures. Emphasis is put on the ability to replicate surface microstructures under normal injection moulding conditions, notably with low cost materials at low mould temperatures. The replication of surface microstructures in injection moulding has been explored for Polypropylene at low mould temperatures. The process conditions were varied over the recommended process window for the material. The geometry of the obtained structures was analyzed. Evidence suggests that step height replication quality depends linearly on structure width in a certain range. Further it was found that in this range, the replication quality depends strongly on process conditions. It was concluded that the achieved step height varies linearly with the mould groove width.
Thermo-mechanical properties of thermoplastic polymer-nanofiller composites
E. Ritzhaupt-Kleissla (b) J. Haußelta (b), T. Hanemanna (b)
a Forschungszentrum Karlsruhe, Institut f. Materialforschung III, D-76021 Karlsruhe, Germany
b Albert-Ludwigs-Universität Freiburg, Institut f. Mikrosystemtechnik (IMTEK), D-79110 Freiburg, Germany
The influence of spherical ceramic nanoparticles as fillers in thermoplastics has been observed by several groups. It is expected to improve material properties of thermoplastics, e.g. hardness, glass transition temperature and thermal expansion coefficient, by incorporating nanosized ceramic particles into the polymer matrix. Nevertheless present literature does not give uniform statements.
In the current work a process chain for homogeneously dispersing inorganic nanosized particles as well as chromophoric dopants into a polymer matrix was developed. Plexit 55, a commercially available reactive resin based on PMMA diluted with MMA was used as polymer matrix. Different methods of dispersing the fillers were applied. Using either a high speed stirrer or a high pressure homogeniser, solid loads of inorganic fillers up to 10 wt% and organic filler contents up to 20 wt% were achieved. Dispersions were polymerised using a UV-photo moulding setup. Test specimens of thermoplastic nanofiller composites were replicated using plastic injection moulding. Resulting parts were investigated with regard to the influence of inorganic and organic fillers on materials’ glass transition temperature, molecular weight, rheological behaviour and thermal expansion coefficient.
Study of the rheological properties of poly(methylmethacrylate) (PMMA) and cyclo-olefin-copolymer (COC) to optimize the hot-embossing process
M. Sahli (a,c), C. Roques-Carmes (a), R. Duffait (b) and C. Khan Malek (c)
a Laboratoire de Microanalyse des Surfaces (LMS), ENSMM, 26 Rue de l’Epitaphe,
b Centre de Transfert des Micro et Nanotechnologies (CTMN), 39 Avenue de l’Observatoire,
c Laboratoire FEMTO-ST, CNRS UMR 6174, Département LPMO, 32 Avenue de l’Observatoire, 25000 Besançon, France.
A study of the rheological properties of two types of amorphous polymeric materials (PMMA and COC) was conducted in order to optimize the operating conditions for the hot embossing of the polymers. The glass transition temperature (Tg), the melt flow index (IF), and the viscosity as a function of shear stress were determined. These intrinsic properties were related to the aptitude of the polymers to reproduce the geometrical shape and surface states of a microstructured mould. The flow imposed to the polymeric material in shear or elongational mode was correlated to this rheological approach.
Micro Assembly Injection Moulding Potential Application in Medical Science
Prof. Dr.-Ing. Dr.-Ing. E.h. Walter Michaeli, Dipl.-Ing. Dirk Opfermann
Institute of Plastics Processing (IKV) at RWTH Aachen University, 52062 Aachen, Germany
The miniaturisation of technical products becomes more important in many technological areas. Many functions can be optimised by the use of micro systems. On less space more functions can be integrated. In the field of medical technology miniaturisation means also new methods of treatment with fewer side effects on the patient. New cures are being developed as a result of the miniaturisation of medical instruments, such as the key hole surgery. Polymers are spread widely in the field of medical applications. Since plastics are a relatively cheap material and polymer parts can easily be reproduced in high series and accuracy, for examples by injection moulding, their use as disposable articles is predetermined. Polymer materials offer a wide range of properties that can be chosen according to the functional necessities.
Multiphoton assisted micro- and nanoprocessing of materials
H. Schucka, Th. Veltena, T. Anhuta, D. Sauera, R. Le Harzicb, K. Königa
a Fraunhofer-Institute for Biomedical Engineering, D-66386 St. Ingbert, Germany
b JenLab GmbH, D-07745 Jena, Germany
Sub-micrometer structuring has been performed on polymers, metal films and semiconductors using near 3
infrared, 90 MHz femtosecond laser pulses at
Pulse energies in the sub-3 nJ range are sufficient to induce multiphoton ionisation when using a high NA 2
objective (e.g. NA = 1.3) in order to obtain transient TW/cm laser intensities. By exploiting this multiphoton effect, we were able to perform patterning of several types of material with sub-micron resolution. Depending on the pulse energy, cut widths of 350 nm and 900 nm have been achieved in 30 nm thin gold films. In polyimide Pyralin PI2611 (HD microsystems) we reached cut widths of 570 nm. Direct laser processing of silicon wafers resulted in cut widths of about 500 nm. Interestingly, besides the 500 nm cut we found two types of additional nanostructures. A first superficial layer contained non-homogenously distributed laser-induced nanocones which represent non-coherent structures. After removing this layer by etching with ammonium fluoride, a second highly coherent “ripple” structure became obvious. Most interestingly, these symmetric features possessed a wavelength (distance) of 50 – 70 nm. A clear dependence of the ripple structures on the polarization was proven.
Double hot-embossing with polymeric intermediate mould
Chantal Khan Maleka, Gaël Thuilliera, Roland Duffaitb , Laurent Guyoutc
a Laboratoire FEMTO-ST, CNRS UMR 6174, Département LPMO, 32 Avenue de l’Observatoire, 25044 Besançon Cedex, France.
b Centre de Transfert des Micro et Nanotechnologies (CTMN), 39 Avenue de l’Observatoire, BP 1445-25007 Besançon Cedex 3, France.
c Department of Applied Mechanical Engineering, University of Franche Comté, 16 Route de Gray, 25030 Besançon Cedex, France.
Our approach uses a two-step replication process for hot embossing and a rigid polymeric intermediate mould. This process overcomes some geometrical limitations in microstructured mould fabrication, enables positive-tone imprinting, prolongs the lifetime of the master, and lowers the overall cost of the replication process.
Microstructure simulations of over-moulded metal micro-sized needles
W. Michaeli, M. Bussmann, B. Renner
Institute of Plastics Processing (IKV), Department of Injection moulding,
RWTH Aachen University, 52062 Aachen, Germany
Beside melt flow simulation in injection moulding the prediction of arising internal properties is essential to forecast final part properties. Crystallisation e.g. causes anisotropic structure set-ups in a moulded cross-section and affects the resulting global mechanical part behaviour.
Nucleation and spherulite growth are complex processes going on during the cooling-down of semi-crystalline polymer melts. The knowledge of the final local structure set-ups and the degree of crystallinity is essential to predict the resulting mechanical part properties in future. Within the scope of the special research centre 370 (SFB 370) at RWTH Aachen University the software SphaeroSim was developed. It allows the online calculation of spherulite growth processes during the cooling of quiescent melts under injection moulding conditions. At present the software is operating two-dimensional using the Cellular Automata Method.
In the past, only part cross-sections with different shapes were focused for simulation, but now it is also possible to consider micro-sized parts with a more complex geometry through a higher resolution of the geometry. Thus it is possible to visualise the going on crystallisation processes by the newly modified software considering new boundary conditions. In this paper simulation results are shown and interpretations to micro-parts properties will be pointed out.











